Cost-efficient Fine Pitch Load Boards Meet Market Needs

Multitest PCBs are leading the way for 0.3 mm pitch array applications
Multitest has again increased its lead over the competition for fine pitch load boards. Advancements in proprietary plating processes along with new technology in drilling and registration techniques ensure reliability, short cycle times and low cost. Multitest has responded to the needs of its customers in the very price sensitive mobile applications and vertical probe cards markets. Fine pitch printed circuit boards are still a challenge in ATE board the industry, but Multitest leverages its expertise in single lamination high aspect PCBs to support the demands of fine pitch BGA and WLCSP applications. Based on many years of experience building high aspect ratios, Multitest deploys state-of-the-art equipment in a stable process to use mechanical drilling for 0.3mm & 0.35mm pitch via in pad constructions. PCBs with 40+ layers at .35 mm can be manufactured in a single lamination process without the use of laser drilled, “stacked”, blind vias. Christopher Cuda, Product Manager, comments: “Using our established and continuously refined fabrication processes for 0.3 & 0.35mm geometries enables us to meet today’s requirements at reasonable cost and with the reliability customers have come to expect from Multitest.” The post Cost-efficient Fine Pitch Load Boards Meet Market Needs appeared first on xcerra.com.

Strip Test for Automotive Applications

European IDM selected Multitest InStrip for high parallel test in automotive production

Multitest InStrip® test handler has been already well-established at a number of different customers in Asia, Europe and US. Recently, Multitest received a multiple order from European IDM that will leverage the high-parallel test capability for standard SOCs for the automotive market.

In the past strip test was considered not be appropriate for applications with high quality requirements – such as automotive or medical – because singulation of the packages would have to take place after testing. Multitest‘s InCarrier concept overcomes these issues and combines the substantial advantages of the strip handling process with the quality driven advantages of the standard test handling process. “Although the automotive market is driven by high quality requirements, reduced cost of test will give our customers a competitive advantage. High parallel strip test will substantially increase their test efficiency”, explains Peter Killermann, product manager.

The Multitest InStrip is known for production proven performance in tri-temp strip test of standard ICs and MEMS. Leading contacting technology, outstanding temperature performance, ease of use as well as greatest flexibility make the InStrip® the optimal solution for high volume final test. Advanced device tracking features as well as factory automation options like recipe management and remote system control support the high quality demands of the automotive users.

“High temperature performance and tri-temp capability is a standard requirement in the automotive market segment. The Multitest InStrip particularly convinced with the proven temperature accuracy and stability for the entire carrier”, concludes Killermann.

Learn more about Multitest strip test solutions

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