Offset Vertical Probe with Scrub Design for Best Test Yield and Lowest Cost of Test

Multitest Adds Link Contactor to Its Interface Products Portfolio

Multitest has launched the new Link Contactor product line for analog, mixed signal, and RF applications. The innovative vertical probe design combines advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads. The Link contactor is based on the technology developed by Titan Semiconductor Tools acquired by Xcerra Corporation in February.

The offset vertical architecture of the Link probe is designed to support superior test yield, maximum repeatability and low repair and replacement cost. The motion of the probe provides scrub through oxides on the IC pads and cleans itself when moving back to its original free height. This motion is fully decoupled from the connection to the test interface board resulting in a stable connection between the probe and the load board pads, avoiding pad wear and carbon debris buildup. This implementation also eliminates the potential for arcing between the probe and the test interface board pad.

The Link probe offers a bandwidth of 60 GHz @ -1 dB. The short signal path minimizes distortion and makes testing with a Link comparable to solder board device testing.

The footprint compatibility of the Link contactor supports easy replacement of existing solutions. The Link probe is available in three different styles – Link HD, Link EC and MicroLink – optimizing the solution to the requirements of the specific test applications.

Tim McNulty, Vice President of the Xcerra Interface Products Group comments: “Titan Semiconductor Tools has developed a unique contactor technology that fits in perfectly with our overall strategy of offering customers best-in-class testers, handlers, interface boards and contactors, as well as, combining those products into total test cell solutions. The Link technology overcomes the mechanical, wear and maintenance issues associated with competitive solutions for the target market of high speed applications.”

Learn more about Link Contactor

The post Offset Vertical Probe with Scrub Design for Best Test Yield and Lowest Cost of Test appeared first on xcerra.com.

Multitest Adds Link Contactors to Its Interface Products Portfolio

Offset Vertical Probe with Scrub Design for Best Yield and Lowest Cost of Test

Multitest has launched the new Link Contactor product line for analog, mixed signal, and RF applications. The innovative vertical probe design combines advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads. The Link contactor is based on the technology developed by Titan Semiconductor Tools acquired by Xcerra Corporation in February.

The offset vertical architecture of the Link probe is designed to support superior test yield, maximum repeatability and low repair and replacement cost. The motion of the probe provides scrub through oxides on the IC pads and cleans itself when moving back to its original free height. This motion is fully decoupled from the connection to the test interface board resulting in a stable connection between the probe and the load board pad, avoiding pad wear and carbon debris buildup. This implementation also eliminates the potential for arching between the probe and the test interface board pad.

The Link probe offers a bandwidth of 60 GHz @ -1 dB. The short signal path minimizes distortion and makes testing with a Link comparable to solder board device testing.

The footprint compatibility of the Link contactor supports easy replacement of existing solutions. The Link probe is available in three different styles – Link HD, Link EC and MicroLink – optimizing the solution to the requirements of the specific test applications.

Tim McNulty, Vice President of the Xcerra Interface Product Group comments: “Titan Semiconductor Tools has developed a unique contactor technology that fits in perfectly with our overall strategy of offering customers best-in-class testers, handlers, interface boards and contactors, as well as, combining those products into total test cell solutions. The Link technology overcomes the mechanical, wear and maintenance issues associated with competitive solutions for the target market of high speed applications.”

Learn more about Link Contactor

The post Multitest Adds Link Contactors to Its Interface Products Portfolio appeared first on xcerra.com.

InCarrier plus Dedicated to High Volume Production

Multitest launches the next generation loader for test in carriers

Multitest is launching the first InCarrierplus with the shipment to a major IDM with high volume production in Europe and Asia. The InCarrierplus is the new state-of-the art loading solution for test in carriers. It is designed to optimize the back-end process at high volume production sites. The InCarrierplus supports the device loading to carrier from standard back-end transport media in a most cost-efficient and productivity-oriented way.

Since Multitest introduced the InCarrier concept to leverage the advantages of strip handling for singulated packages, this process has been well-accepted in the market. Up to now more than 3 billion packages were tested on InCarrier set-ups. The customers fully benefit from the robust, high parallel test solution. The advantages are particularly recognized for large production lots, long test times and/or small packages.

The InCarrierplus is minimizing cost of loading and increases throughput  up to 16,000 units per hour depending on packages sizes. The InCarrierplus has been optimized for smaller footprint and requires less space on the test floor. The InCarrierplus is supporting standard back-end transport media – such as JEDEC trays and bulk – and can be smoothly integrated in state-of-the-art production flows and lines. On the test floor the InCarrierplus / InStrip solution can be combined with standard final packaging equipment for tape & reel, tube or tray output and fits therefore seamless into the production process.

Andreas Nagy, Senior Director Marketing commented: “Multitest was the first supplier to who actually offered the test in carrier solution – the first Multitest InCarrier Loader/Unloader was launched as a dedicated loading and unloading tool. The InCarrierplus leads this concept to the next level of overall productivity improvement. This gets achieved by significant loading cost reduction at the InCarrierplus and the elimination of the unloading cost by direct un-load into tape & reel at traditional final packaging equipment for high volume production”

Learn more about InCarrierplus

The post InCarrier plus Dedicated to High Volume Production appeared first on xcerra.com.