Multitest Adds Link Contactor to Its Interface Products Portfolio
Multitest has launched the new Link Contactor product line for analog, mixed signal, and RF applications. The innovative vertical probe design combines advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads. The Link contactor is based on the technology developed by Titan Semiconductor Tools acquired by Xcerra Corporation in February.
The offset vertical architecture of the Link probe is designed to support superior test yield, maximum repeatability and low repair and replacement cost. The motion of the probe provides scrub through oxides on the IC pads and cleans itself when moving back to its original free height. This motion is fully decoupled from the connection to the test interface board resulting in a stable connection between the probe and the load board pads, avoiding pad wear and carbon debris buildup. This implementation also eliminates the potential for arcing between the probe and the test interface board pad.
The Link probe offers a bandwidth of 60 GHz @ -1 dB. The short signal path minimizes distortion and makes testing with a Link comparable to solder board device testing.
The footprint compatibility of the Link contactor supports easy replacement of existing solutions. The Link probe is available in three different styles – Link HD, Link EC and MicroLink – optimizing the solution to the requirements of the specific test applications.
Tim McNulty, Vice President of the Xcerra Interface Products Group comments: “Titan Semiconductor Tools has developed a unique contactor technology that fits in perfectly with our overall strategy of offering customers best-in-class testers, handlers, interface boards and contactors, as well as, combining those products into total test cell solutions. The Link technology overcomes the mechanical, wear and maintenance issues associated with competitive solutions for the target market of high speed applications.”
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