Combining Leading Temperature Performance with Highest Flexibility for Pick and Place Handling

Multitest has shipped the first MT2168 XT for ambient/hot/cold applications Multitest shipped the first MT2168 XT tri-temp pick and place handler to a major IDM. The MT2168 XT combines the innovative architecture of the MT2168 ambient/hot handler with leading temperature test performance, for which Multitest has been known for decades. The MT2168 XT offers greatest flexibility and best performance for highest return on investment and lowest cost of test. It leverages more than 30 years of experience in test handling and the technology leadership in temperature test. The MT2168 XT provides a reliable test handling solution for the complete range of packages, which are usually provided in trays, at ambient, ambient/hot and ambient/hot/cold temperature conditions. The innovative architecture and material flow offers significant advantages in throughput, stability and reliability, as well as, floor space requirements and conversion kit cost. A wide range of options allow for extending the capabilities of the MT2168 XT in the field according to actual needs. The site pitch kit supports a fully flexible contact site layout to comply with the design of existing load boards. Sophisticated plunging solutions ensure best first pass yield in high volume production. Günther Jeserer, Vice President Gravity and Pick & Place Products, comments: “Even before the public launch of this new pick and place handler, we received multiple orders from our customers, which see the unique advantage of this highly modular and scalable tri-temp handler. The MT2168 XT leverages both, the innovative design of our MT2168 platform and the more than 30 years of Multitest’s experience in test handling – particularly in temperature testing. It provides a state-of-the-art test handling solution for today’s applications and is well equipped to meet future requirements.” To learn more about the MT2168 XT tri-temp pick and place handler, please visit The post Combining Leading Temperature Performance with Highest Flexibility for Pick and Place Handling appeared first on

High Volume Testing of Fingerprint Sensors with Multitest InStrip

Major OSAT deploys Multitests solution for an application of one of the worlds leading fingerprint sensor companies Multitest’s InStrip has been selected to be the platform of a set up for high parallel testing of fingerprint sensors in China. The solution relies on Multitest’s well established and production proven InStrip / InCarrier, which is extended to fingerprint testing by a dedicated conversion kit (CK). The Multitest solution supports up to 90 devices tested in parallel. It is fully CK based and does not require any changes on the InStrip handler base unit. The solution leverages a special contactor design and a new concept for the cylinders, which apply the controlled and homogenous mechanical pressure on a very small area on the device under test. Andreas Bursian, Director InStrip & InMEMS Products, explains: “Fingerprint sensing technology has been considered to be one of the most reliable and cost effective biometrics technologies. Currently, we see a rapid growth in the demand for fingerprint sensors mostly driven by uses in consumer applications and smart homes but also for governmental and industrial security. The market is expecting to experience a double digit growth rate in the coming five years. This requires high volume proven test solutions. With testing up to 90 devices in parallel, Multitest offers a unique solution, which exceeds the parallel test capability of alternative (wafer probing) solution significantly.” To learn more about Multitest’s MEMS test solution for high parallel testing, please visit The post High Volume Testing of Fingerprint Sensors with Multitest InStrip appeared first on

Multitest Introduces ACE Contactor:

Cost-efficient contactor solution for best RF performance Multitest recently introduces the ACE Contactor, which offer optimal RF performance for fine pitch FBGA, QFN and wafer-level packages at an attractive. Typical applications for this new contactor are Power Amplifiers, RF switches and mobile communications. The ACE probe has a revolutionary, which provides exceptional electrical performance, both DC and RF. The ACE probe is manufactured from HyperCore™ base material, which is a proprietary material of Xcerra’s ECT Contact Product Group. HyerCore™ combines the mechanical properties of high carbon steel, with the electrical properties of BeCu and non-oxidizing properties of a precious metal. The materials and architecture create a very robust probe with a very working life and best yield. The electrical and mechanical performance, combined with the long probe life, deliver low overall cost of test, which are unprecedented for RF contactors. Within the range of applications the ACE probe are compatible with all device types, platings, and pitches; and all test applications, including singulated devices, strip test and wafer-scale test. The ACE contactor supports pitches down to 0.4 mm. Jason Mroczkowski, Director RF Product Development and Marketing explains: “ACE contactor has been evaluated by initial customers, which report significant improvements compared to other solutions: More than double the probe life and substantially better figures for current consumption, gain, standard deviation, and power efficiency.” To learn more about the Multitest ACE Contactor, please visit The post Multitest Introduces ACE Contactor: appeared first on