3D Integration - KGD and final test are not enough
- Higher complexity in the assembly increases risk of malfunctions
- In-process test ensures best production yield and improves process control
Established test processes cannot deal with the risks in assembly 3D packages. New process steps are applied on the ultra-thin wafer in between probing and assembly. Bad parts in a die stack can corrupt good ones. KGDs cannot eliminate the risk. Final test is very late, before they get discovered during final test. Smart test distribution with sharing as many data as possible will add the concept of "known good stack".
Increasing complexity of the assembly process requires close cooperation between semiconductor manufacturers and equipment companies. 3D packages will increase the amount of possible defects and also the resulting monetary loss. Additional tests are required. Ideal set-ups from wafer probing to final test will leverage process synergies. Experienced equipment suppliers are needed to cooperatively develop the best possible solution.
Requirements of In-process test are going far beyond final test technology. Plug & Yield enables aligned design and optimization of the test cell components to achieve viable, robust and cost efficient solutions. Collaborative value engineering of the fully integrated and harmonized set-ups enables the development of the best technical solution at the lowest price.
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