Multitest at ECTC 2013

Solutions for the Future
Build On More Than 30 Years Of Experience


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Sensor Test and Calibration: 

For packages in tubes, trays, strips or carriers


  • Multisite x4, x8, x16, x32, x72, x144
  • Modular solutions
  • Variety of applications
  • In combination with standard test handlers
  • Fast package conversion
  • MEMS stimulus during test
  • Temperature conditioning


MEMS Fusion: multiple sensors in one package

Test of up to 9 DoF by one insertion


  • Time- and cost-efficient
  • Test is closest to the final applications in reality



    • 3D Accelerometer +
  • 3D Gyroscope +
  • 3D Magnetometer


3D Integration: MEMS in heterogeneous stacks

Partial stack test and full functional final test 



  • Cost efficient solutions for in-process test of TSV partial stacks
  • Respecting sensibility of bare dies
  • Optimized for high yield
  • Full temperature conditioning AND MEMS stimulus in final test










Multitest is the leading supplier of high-parallel MEMS test and calibration equipment, packages with multiple sensors (up to 9 DOF) and MEMS in heterogeneous 3D stacks.

At Semicon Taiwan we will showcase our InMEMS solution:

The set-up allows high parallel MEMS test and calibration. It combines a standard strip  handler - Multitest InStrip - and an InMEMS module that is for up to 9 DoF test.



The InStrip can handle both strips and packages in carriers (

The architecture of the InStrip ideally allows configuration for 3D in-process test of TSV partial stacks