Multitest at ECTC 2013

Solutions for the Future
Build On More Than 30 Years Of Experience

 

Free Download 

Download Request


 
 

 

Sensor Test and Calibration: 

For packages in tubes, trays, strips or carriers

 

  • Multisite x4, x8, x16, x32, x72, x144
  • Modular solutions
  • Variety of applications
  • In combination with standard test handlers
  • Fast package conversion
  • MEMS stimulus during test
  • Temperature conditioning
 
 

 

MEMS Fusion: multiple sensors in one package

Test of up to 9 DoF by one insertion

 

  • Time- and cost-efficient
  • Test is closest to the final applications in reality

 

e.g.:

    • 3D Accelerometer +
  • 3D Gyroscope +
  • 3D Magnetometer
 
 

 

3D Integration: MEMS in heterogeneous stacks

Partial stack test and full functional final test 

 

 

  • Cost efficient solutions for in-process test of TSV partial stacks
  • Respecting sensibility of bare dies
  • Optimized for high yield
  • Full temperature conditioning AND MEMS stimulus in final test

 

 

 

 
 

 

 

 

 

 

Multitest is the leading supplier of high-parallel MEMS test and calibration equipment, packages with multiple sensors (up to 9 DOF) and MEMS in heterogeneous 3D stacks.

At Semicon Taiwan we will showcase our InMEMS solution:

The set-up allows high parallel MEMS test and calibration. It combines a standard strip  handler - Multitest InStrip - and an InMEMS module that is for up to 9 DoF test.

 

 

The InStrip can handle both strips and packages in carriers (www.multitest.com/InCarrier).

The architecture of the InStrip ideally allows configuration for 3D in-process test of TSV partial stacks

(www.multitest.com/InStrip3D).

 

 
 

Do not miss us at GSA 

 

LTX-Credence Launches X-Series PAx-ac Tester