High Parallel Test for Singulated Packages


> strip-like device carrier for single device
> no singulated after test
> combines the advantages of the singulated device test with the advantages of strip test


Key Features


  • full device traceability
  • re-test option on original equipment
  • usable as transport means for burn-in prior to final test


Supported Input Media


  • JEDEC tray to carrier
  • tube to carrier
  • bulk to carrier
  • wafer frame to carrier


Supported Output Media


  • carrier to JEDEC tray
  • carrier to tube
  • carrier to bulk
  • carrier to tape & reel


Handling Solution for


  • leaded and leadless devices
  • large and even smallest package sizes down to 1 x 1 mm
  • ASIC test
  • MEMS calibration test

Multitest InCarrier® is a strip-like device carrier for single devices that combines the advantages of the singulated device test process with the advantages of high parallel strip test.


The InCarrier® material flow at the test floor remains over all similar to the established standard process. Unlike to strip test, the InCarrier® test requires no singulation after test. Therefore the final test remains true final test. This way it overcomes the boundaries of strip test and meets the automotive 6 sigma - 0 PPM requirements.


Leveraging the strip like design the InCarrier® ensures robust test-handling for even smallest devices and supports high parallel test.

The InCarrier® supports all major applications such as:

  • consumer
  • automotive and power devices
  • RF and communication
  • logic, analog and microcontrollers





MEMS and Sensor Test and Calibration Portfolio