InCarrier®

High Parallel Test for Singulated Packages

 

> strip-like device carrier for single device
> no singulated after test
> combines the advantages of the singulated device test with the advantages of strip test
 

 

Key Features

  

  • full device traceability
  • re-test option on original equipment
  • usable as transport means for burn-in prior to final test
 
 

 

Supported Input Media

    

  • JEDEC tray to carrier
  • tube to carrier
  • bulk to carrier
  • wafer frame to carrier

 

Supported Output Media

   

  • carrier to JEDEC tray
  • carrier to tube
  • carrier to bulk
  • carrier to tape & reel
 
 

 

Handling Solution for

  

  • leaded and leadless devices
  • large and even smallest package sizes down to 1 x 1 mm
  • ASIC test
  • MEMS calibration test
  •  
 
 

Multitest InCarrier® is a strip-like device carrier for single devices that combines the advantages of the singulated device test process with the advantages of high parallel strip test.

 

The InCarrier® material flow at the test floor remains over all similar to the established standard process. Unlike to strip test, the InCarrier® test requires no singulation after test. Therefore the final test remains true final test. This way it overcomes the boundaries of strip test and meets the automotive 6 sigma - 0 PPM requirements.

 

Leveraging the strip like design the InCarrier® ensures robust test-handling for even smallest devices and supports high parallel test.

The InCarrier® supports all major applications such as:

  • consumer
  • automotive and power devices
  • RF and communication
  • logic, analog and microcontrollers

 

 

 

 
 

Do not miss us at GSA 

 

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