Solution for High Power Applications




  • for high power IC test applications up to 1000+ Amperes
  • stable and low resistance
  • extended temperature range up to 175° C
  • optimized for taking thermal stress during test
  • lifespan of more than 1 Mio. Insertions
  • plunge-to-board interface


Contactor for


  • QFP, SO, TO, DPAK devices and power modules
  • lead pitches down to 0.5 mm
  • tri-temp applications: -60°C to 175°C