Handling Solution for Partially Stacked Dies
- supports electrical in process test in assembly
- leverages the experience from the well established InStrip/InMEMS platforms
The architecture of the Multitest InStrip allows configuring the equipment to ideally fit to the special requirements of bare die test handling in a cost-efficient and reliable way.
The InStrip3D respects the highly sensible features of bare dies and is able to support smallest structures.
The InStrip3D utilizes the robust machine structure to balance force and deflection for best test yield.
Based on the InStrip / InMEMS platforms the InStrip3D is able to support precise tri-temp test and MEMS test and calibration.
For more information please contact us.