MT2168 Features to Support “Mobility” in Final Test
up to 32 contact sites
up to 18 k uph
for small pitch packages
total plunger force up to 5,000N
smooth, shock-proof actions
ATC – active thermal control (managing power dissipation)
double side contacting (PoP)
Interface Features to Support “Mobility”
low inductance high bandwidth
low force options
coplanarity, dimensional stability
accurate probe positioning for precise alignment
pitches down to 0.3mm
full Kelvin on arrays down to 0.4mm pitch
Mobile devices such as smartphone, tablets and notebooks allow connecting anywhere at anytime. With the internet of things it will be “anywhere-anytime-“anything”. Semiconductors for mobile applications need to meet dedicated requirements. Semiconductor design and production implement new approaches. Advanced packaging technologies need to be supported by cost-efficient test solutions.
With mobility driving volume, test equipment needs to ensure best cost of test with cost-efficient, high-parallel testing. Technically, the challenges of highly integrated packages such as PoPs and 3D ICs have to be addressed.
Interface products need to ideally combine best electrical performance with reliable mechanical features.
Mobility drives new package types, advanced IC functionalities and integration. The ideal test setup will leverage the optimum features from each test cell element, harmonize the elements, and offer a cost-efficient, high performance solution.
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