Mobility – the Driving Force for Electronics
Find the best test solution for
- high volumes, low prices
- advanced packaging
- highly integrated ICs
Mobile devices such as smartphone, tablets and notebooks allow connecting anywhere at anytime. With the internet of things it will be “anywhere-anytime-“anything”. Semiconductors for mobile applications need to meet dedicated requirements. Semiconductor design and production implement new approaches. Advanced packaging technologies need to be supported by cost-efficient test solutions.
With mobility driving volume, test equipment needs to ensure best cost of test with cost-efficient, high-parallel testing. Technically, the challenges of highly integrated packages such as PoPs and 3D ICs have to be addressed.
Interface products need to ideally combine best electrical performance with reliable mechanical features.
Mobility drives new package types, advanced IC functionalities and integration. The ideal test setup will leverage the optimum features from each test cell element, harmonize the elements, and offer a cost-efficient, high performance solution.
Multitest Solutions for Mobility: