Xcerra at Semicon Japan
Tokyo Big Sight, December 3 – 5
“Modular high volume sensor test line – an opportunity for MEMS makers”
Speaker: Friday, December 5
Time: 11:35 – 12:00 pm
Session: STS Test Session
Time: TechSTAGE South
Speaker: Hidenori Onodera, Business Development Manager
One of the difficulties for MEMS makers is that for most part the industry relies on test solutions which do not have the technology to scale to larger volumes while being cost competitive.
As a consequence the MEMS industry is now working with OSATs. Typically OSATs have a conservative capex policy. Cost effective and competitive sensor test requires significant capital invest and sensor unit volumes to justify it.
The majority of the sensor makers do not have the volume to justify the capex on their own. This poses a unique opportunity for the largest OSATs. If they were to invest in a high volume line they could offer the required capability to the MEMS community at competitive cost.
Additionally, highly automated equipment will reduce the labor component of test cost per device and make such a line economically feasible.