News

Multitest’s MT9510 offers new contact site layouts

 

Multitest’s well-established MT9510 tri-temp pick and place handler is now available with various site pitch layouts, which are compatible with major standard handlers in the market. The new site pitch layouts enable to customer to re-use existing loadboards from other handling equipment for applications on the MT9510.

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Multitest launches magnetic (MRS) sensor test module for MT9510

 

Multitest has added a magnetic rotation stimulus (MRS) module for sensor test on the MT9510 handler to the MEMS/sensor test product line. The module allows for x and y axis testing of magnetic sensors on a flexible and well-established pick and place handler platform.

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Multitest launches local kit design team in the Philippines

 

Multitest makes a significant step to expand customer support. Starting May 2015 an additional design team for conversion kits will be supporting the needs of Asian customers.

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Multitest MT2168 Pick-and-Place Handler offers multi-temperature testing within one plunger cycle

 

The Multitest MT2168 pick-and-place handler now offers multi-temperature test with only one insertion. The highly dynamic temperature control allows for testing at multiple set temperatures within one plunger cycle.

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MT9928 gravity handler, ecoAmp contactor and Multitest PCB

 

The Multitest MT9928 gravity handler ideally supports the special features of the recently launched ecoAmp Kelvin contactor. Field proven temperature performance and highest positioning accuracy ensure cost-efficient and reliable tri-temp testing as well as highest test yield.

 

The MT9928 features leading thermal performance across the entire range from -55° C to + 155° C. Temperature accuracy of +/- 2.0°C and stability of +/- 0.5°C are proven by numerous installations at high-volume production sites.

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Get the comprehensive tutorial

 

Power integrity is the discipline of providing clean power to the DUT by minimizing noise on the Power Delivery Network (PDN). It is quickly becoming one of the biggest challenges in test interface design.

 

Power integrity is a challenge whose influence will continue to grow in the coming years.

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Our first Plug & Yield solution for the test of 3D packages was recently shipped and has been released to the customer’s production now.

 

The fully integrated setup consists of a Multitest InStrip3D, a test interface board and a contacting solution based on vertical spring technology. The system will be used for electrical test partial stacks during assembly of a mobile SoC.

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